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High-speed (40 Gb/s to 1000 Gb/s), optical connectivity solutions
for semiconductor packaging and data transfer applications
www.reflexphotonics.com
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Cermic Substrates and various materials for microwave applications,
www.coorstek.com,
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Substrates(Ceramic, AlN, Al, BeO, Sappire,etc.) with ultra precision
service,surface finish tolerances(公差): 0.000001 inches max.
www.accumet.com
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